Circuit device with conductive patterns separated by...

Details Circuit device with conductive patterns separated by... Circuit device with conductive patterns separated by...

2005-12-06

2005-12-06

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Groove

C257S117000, C257S118000, C257S466000, C257S496000, C257S618000, C257S619000, C257S620000, C257S626000, C257S647000

Reexamination Certificate

active

06972477

ABSTRACT:
To make thin a circuit device10in which are incorporated a plurality of types of circuit elements12that differ in thickness, first conductive patterns, onto which comparatively thin circuit elements12A are mounted, are formed thickly, and second conductive patterns11B, onto which comparatively thick second circuit elements12B are mounted, are formed thinly. Also, fine wiring parts may be formed using the thinly formed second conductive patterns12B. Thus even in the case where thick circuit elements are incorporated, by affixing such circuit elements onto the thinly formed second conductive patterns11B, the total thickness can be made thin. Thinning of circuit device10as a whole can thus be accomplished.

REFERENCES:
patent: 5306872 (1994-04-01), Kordus et al.
patent: 2003/0017645 (2003-01-01), Kabayashi et al.
patent: 2002-76246 (2002-03-01), None

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