Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2008-02-28
2011-12-06
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S678000, C257S691000, C257S724000, C257S773000, C257S776000, C257S783000, C257S787000, C257SE23178, C257SE21513, C257SE21514
Reexamination Certificate
active
08072062
ABSTRACT:
A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the circuit device is coplanar with the conductive layer. At least a portion of the conductive layer may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device may be placed on a conductive layer such that an active surface of circuit device is between conductive layer and an opposite surface of circuit device. The conductive layer has at least one opening to expose the active surface of circuit device. The encapsulant may be electrically conductive or electrically non-conductive.
REFERENCES:
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4630096 (1986-12-01), Drye
patent: 4722914 (1988-02-01), Drye
patent: 4783695 (1988-11-01), Eichelberger
patent: 4792533 (1988-12-01), Drye
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4882200 (1989-11-01), Liu et al.
patent: 4890156 (1989-12-01), Drye
patent: 5057903 (1991-10-01), Olla
patent: 5161093 (1992-11-01), Gorczyca
patent: 5169678 (1992-12-01), Cole et al.
patent: 5310702 (1994-05-01), Yoshida et al.
patent: 5315486 (1994-05-01), Fillion
patent: 5331205 (1994-07-01), Primeaux
patent: 5353498 (1994-10-01), Fillion
patent: 5525834 (1996-06-01), Fischer et al.
patent: 5576869 (1996-11-01), Yoshida
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5592025 (1997-01-01), Clark
patent: 5616958 (1997-04-01), Laine et al.
patent: 5643472 (1997-07-01), Engelsberg et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5841193 (1998-11-01), Eichelberger
patent: 5866952 (1999-02-01), Wojnarowski et al.
patent: 5989935 (1999-11-01), Abbott
patent: 5990545 (1999-11-01), Schueller et al.
patent: 6114763 (2000-09-01), Smith
patent: 6159767 (2000-12-01), Eichelberger
patent: 6201298 (2001-03-01), Sato et al.
patent: 6249046 (2001-06-01), Hashimoto
patent: 6396148 (2002-05-01), Eichelberger et al.
patent: 6441474 (2002-08-01), Naitoh et al.
patent: 6515361 (2003-02-01), Lee et al.
patent: 6573123 (2003-06-01), Li et al.
patent: 6700182 (2004-03-01), Yamashita et al.
patent: 6703702 (2004-03-01), Inoue et al.
patent: 6838776 (2005-01-01), Leal et al.
patent: 7361987 (2008-04-01), Leal et al.
patent: 2002/0025607 (2002-02-01), Danno et al.
patent: 2002/0064931 (2002-05-01), Ong
patent: 2003/0104653 (2003-06-01), Farnworth
patent: 0777274 (1997-06-01), None
patent: 08-046090 (1996-02-01), None
patent: 8-73832 (1996-03-01), None
patent: H10-107184 (1998-04-01), None
patent: 11-135680 (1999-05-01), None
patent: H11-312756 (1999-11-01), None
patent: 2001-177005 (2001-06-01), None
patent: 2001-189411 (2001-07-01), None
patent: 2002-280491 (2002-09-01), None
patent: 2002-314029 (2002-10-01), None
patent: 2003-068932 (2003-03-01), None
patent: 2003-249604 (2003-09-01), None
patent: 2004-95818 (2004-03-01), None
patent: 417220 (2001-01-01), None
patent: 473962 (2002-01-01), None
patent: PCT/CA1997/000946 (1997-12-01), None
patent: 200221595 (2002-03-01), None
patent: 200233751 (2002-04-01), None
Leal George R.
Mangrum Marc Alan
Prack Edward R.
Sawyer Brian D.
Wenzel Robert J.
Clark Jasmine
Freescale Semiconductor Inc.
Hill Daniel D.
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