Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-10-11
2005-10-11
Chaudhuri, Olik (Department: 2824)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S617000
Reexamination Certificate
active
06953712
ABSTRACT:
A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto the overcoat resin. A first conductive film23A and a second conductive film23B, which are laminated with an interlayer insulating layer22interposed in between, are formed. By selectively removing the first conductive film, a first conductive wiring layer12A is formed and the first conductive wiring layer is covered with an overcoat resin18. Overcoat resin18is irradiated with plasma to roughen its top surface. A sealing resin layer17is formed so as to cover the top surface of the roughened overcoat resin18and circuit elements13.
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Igarashi Yusuke
Mizuhara Hideki
Sakamoto Noriaki
Usui Ryosuke
Chaudhuri Olik
Fish & Richardson P.C.
Kanto Sanyo Semiconductors Co., Ltd.
Luhrs Michael K.
Sanyo Electric Co,. Ltd.
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