Circuit device and manufacturing method thereof

Details Circuit device and manufacturing method thereof Circuit device and manufacturing method thereof

2008-01-01

2008-01-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S750000, C257S762000, C257S773000, C257S775000, C257S776000, C257S793000, C257S795000, C257SE29165, C257SE21537

Reexamination Certificate

active

11141461

ABSTRACT:
A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.

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