Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S750000, C257S762000, C257S773000, C257S775000, C257S776000, C257S793000, C257S795000, C257SE29165, C257SE21537

Reexamination Certificate

active

07315083

ABSTRACT:
A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.

REFERENCES:
patent: 5945258 (1999-08-01), Shimizu et al.
patent: 6864121 (2002-05-01), Sakamoto et al.
patent: 6528874 (2003-03-01), Iijima et al.
patent: 6680530 (2004-01-01), Pillai et al.
patent: 6717267 (2004-04-01), Kunikiyo
patent: 6724638 (2004-04-01), Inagaki et al.
patent: 6759740 (2004-07-01), Onitani et al.
patent: 6787918 (2004-09-01), Tsai et al.
patent: 6803658 (2004-10-01), Suzuki
patent: 6896953 (2005-05-01), Taga et al.
patent: 7091593 (2006-08-01), Ishimaru et al.
patent: 2003/0011070 (2003-01-01), Iijima et al.
patent: 2003/0062624 (2003-04-01), Asahi et al.
patent: 2003/0160325 (2003-08-01), Yoneda et al.
patent: 2004/0262644 (2004-12-01), Naruse et al.
patent: 1140973 (1997-01-01), None
patent: 1292635 (2001-04-01), None
patent: 1304175 (2001-07-01), None
patent: 1348205 (2002-02-01), None
patent: 06-177295 (1994-06-01), None
patent: B-3549316 (1996-12-01), None
patent: A 2001 274333 (1997-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2768486

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.