Circuit device and manufacturing method of circuit device

Details Circuit device and manufacturing method of circuit device Circuit device and manufacturing method of circuit device

2006-10-24

2006-10-24

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S110000, C438S124000, C438S127000, C438S109000

Reexamination Certificate

active

07125798

ABSTRACT:
After a trench54is formed in a conductive foil60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil60as the support substrate. After being inverted, the conductive foil60is polished on the insulating resin50as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths51and the circuit elements52are supported by the insulating resin50, without the use of the support substrate. And the interconnects L1to L3requisite for the circuit are formed, and can be prevented from slipping because of the curved structure59and a visor58.

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