Circuit device

Details Circuit device Circuit device

2006-03-28

2006-03-28

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S784000, C257S738000, C257S684000

Reexamination Certificate

active

07019409

ABSTRACT:
Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.

REFERENCES:
patent: 6498392 (2002-12-01), Azuma
patent: 11-340257 (1999-12-01), None

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