Circuit-connecting material and circuit terminal connected...

Stock material or miscellaneous articles – Composite – Of addition polymer from unsaturated monomers

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S325000, C156S326000, C156S327000, C428S522000

Reexamination Certificate

active

07618713

ABSTRACT:
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

REFERENCES:
patent: 4212959 (1980-07-01), Fukami et al.
patent: 4243462 (1981-01-01), Hori et al.
patent: 4607087 (1986-08-01), Moriya et al.
patent: 4735847 (1988-04-01), Fujiwara et al.
patent: 4735988 (1988-04-01), Takada et al.
patent: 4963974 (1990-10-01), Ushio et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5096962 (1992-03-01), Holmes-Farley et al.
patent: 5120665 (1992-06-01), Tsukagoshi
patent: 5158818 (1992-10-01), Aurichio
patent: 5162087 (1992-11-01), Fukuzawa et al.
patent: 5183969 (1993-02-01), Odashima
patent: 5208266 (1993-05-01), Yamazaki
patent: 5395876 (1995-03-01), Frentzel et al.
patent: 5475048 (1995-12-01), Jamison et al.
patent: 6097100 (2000-08-01), Eguchi et al.
patent: 6124023 (2000-09-01), Furuta et al.
patent: 6762249 (2004-07-01), Fujinawa et al.
patent: 6777464 (2004-08-01), Watanabe et al.
patent: 6939913 (2005-09-01), Arifuku et al.
patent: 7141645 (2006-11-01), Fujinawa et al.
patent: 7241644 (2007-07-01), Arifuku et al.
patent: 2004/0222408 (2004-11-01), Watanabe et al.
patent: 2005/0151271 (2005-07-01), Tatsuzawa et al.
patent: 2005/0176882 (2005-08-01), Arifuku et al.
patent: 2006/0014860 (2006-01-01), Watanabe et al.
patent: 2006/0060969 (2006-03-01), Watanabe et al.
patent: 2006/0063366 (2006-03-01), Watanabe et al.
patent: 2006/0100314 (2006-05-01), Arifuku et al.
patent: 2006/0252843 (2006-11-01), Fujinawa et al.
patent: 2007/0299172 (2007-12-01), Watanabe et al.
patent: 2008/0054225 (2008-03-01), Watanabe et al.
patent: 2008/0057742 (2008-03-01), Watanabe et al.
patent: 2008/0064233 (2008-03-01), Watanabe et al.
patent: 2008/0064849 (2008-03-01), Tatsuzawa et al.
patent: 0 488 561 (1992-06-01), None
patent: 50-126954 (1975-10-01), None
patent: 52-090537 (1977-07-01), None
patent: 59-159866 (1984-09-01), None
patent: 59-221371 (1984-12-01), None
patent: 60-262430 (1985-12-01), None
patent: 61-148277 (1986-07-01), None
patent: 61-194732 (1986-08-01), None
patent: 61-296077 (1986-12-01), None
patent: 62-141083 (1987-06-01), None
patent: 63-083181 (1988-04-01), None
patent: 03-137121 (1991-06-01), None
patent: 04-216884 (1992-08-01), None
patent: 04-275380 (1992-09-01), None
patent: 05-347464 (1993-12-01), None
patent: 06-295617 (1994-10-01), None
patent: 7-211145 (1995-08-01), None
patent: 07-326635 (1995-12-01), None
patent: 08-111124 (1996-04-01), None
patent: 08-253739 (1996-10-01), None
patent: 08-315885 (1996-11-01), None
patent: 08-319461 (1996-12-01), None
patent: 08-325543 (1996-12-01), None
patent: 09-025394 (1997-01-01), None
patent: 9-55448 (1997-02-01), None
patent: 09-095652 (1997-04-01), None
patent: 09-169958 (1997-06-01), None
patent: 09-176309 (1997-07-01), None
patent: 09-291259 (1997-11-01), None
patent: 10-273626 (1998-10-01), None
patent: 10-273630 (1998-10-01), None
patent: 11-279511 (1999-10-01), None
patent: 11-279513 (1999-10-01), None
patent: 2004-128465 (2004-04-01), None
patent: 3587859 (2004-11-01), None
patent: 3877090 (2006-11-01), None
patent: 98/44067 (1998-10-01), None
Machine translation of JP 08-111124, provided by the JPO website.
Machine translation of JP 08-325543, provided by the JPO website.
Machine translation of JP 08-319461, provided by the JPO website.
Osswald et al. “Material Science of Polymers for Engineers” pp, 23-27; 1996.
Calder et al. Ask a Scientist: Molecular Size and Solubility (2002) http://www.newton.dep.anl.gov/askasci/chem00/chem00888.htm.
Machine Translation of JP 08-253739 (1996), provided by the JPO website.
Search Report issued in corresponding European Application No. 06115661.8, completed Sep. 8, 2006 and mailed Sep. 20, 2006.
“Chemical Dictionary,” Morikita Publish. Inc., pp. 833-834, 1986.
Observations by Third Parties Under EPC Art. 115, 23 pages.
English Translation of JP 08-325543, prepared by the Japanese Patent Office, 2003, 12 pages.
ACS English Abstracts for JP 11-279511 and JP 11-279513, 2002.
Eurpoean Search Report, in EP 98 91 1125, May 22, 2000, 4 pages.
European Search Report, in EP 04 02 8659, Mar. 30, 2005, 3 pages.
Office Action issued in parent U.S. Appl. No. 10/860,578 dated Nov. 27, 2008.
Office Action Issued in the Corresponding U.S. Appl. No. 11/841,422 Dated Jan. 9, 2008.
Office Action Issued in the Corresponding U.S. Appl. No. 11/227,212 Dated Jan. 10, 2008.
Office Action Issued in the Corresponding U.S. Appl. No. 11/227,231 Dated Mar. 26, 2008.
Kirak, Arzu et al., “Dielectric properties and electric conductivity of talc and doped talc,” J. Phys. D: Appl Phys. 32, 1999, pp. 1919-1927.
Office Action issued in a counterpart European patent application No. 06115661.8, dated Oct. 8, 2008 (which cites Non-Patent Literature Document 3 above).
Office Action issued in a counterpart U.S. Appl. No. 10/860,578, dated Oct. 17, 2008 (which cited United States Patent Document 1 above).
Office Action issued in a counterpart U.S. Appl. No. 11/841,483, dated Dec. 24, 2008 (which cited United States Patent Documents 2-5 and Foreign Patent Document 4 above).
Office Action issued in co-pending U.S. Appl. No. 11/841,532, dated Jan. 9, 2009.
English translation of Office Action issued in related Japanese Patent Application No. P2003-186397, dated Nov. 27, 2008 and mailed Dec. 2, 2008.
English translation of Office Action issued in related Japanese Patent Application No. P2005-116155, dated Oct. 10, 2008 and mailed Oct. 21, 2008.
English translation of Office Action issued in related Japanese Patent Application No. P2005-116147, dated Sep. 3, 2008 and mailed Sep. 9, 2008.
Calder et al., “Ask a Scientist: Molecular Size and Solubility” , 2002, http://www.newton.dep.anl.gov/askasci/ chem00/chem00888.htm.
Office Action issued in related U.S. Appl. No. 11/227,186, dated Aug. 25, 2008.
Office Action issued in related U.S. Appl. No. 11/227,231, dated Sep. 24, 2008.
Office Action issued in related U.S. Appl. No. 11/227,212, dated Sep. 24, 2008.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit-connecting material and circuit terminal connected... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit-connecting material and circuit terminal connected..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit-connecting material and circuit terminal connected... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4053109

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.