Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-11-27
2007-11-27
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21511, C257SE21523
Reexamination Certificate
active
10843174
ABSTRACT:
An interposer and a method of manufacturing a flexible radio frequency (RF) type device having an IC and thin film circuits, such as an antenna. The device is made by using an easy-to-insert interposer subassembly with pre-positioned ICs to mechanically and electrically attach an IC to the thin film circuit. A method of mass producing radio frequency devices comprising antennas and ICs on interposers that are physically and electrically connected to the antennas using a pressure sensitive adhesive.
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Eberhardt Noel H.
Pennaz Thomas J.
Coleman W. David
Motorola Inc.
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