Circuit chip connector and method of connecting a circuit chip

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C257SE21511, C257SE21523

Reexamination Certificate

active

10843174

ABSTRACT:
An interposer and a method of manufacturing a flexible radio frequency (RF) type device having an IC and thin film circuits, such as an antenna. The device is made by using an easy-to-insert interposer subassembly with pre-positioned ICs to mechanically and electrically attach an IC to the thin film circuit. A method of mass producing radio frequency devices comprising antennas and ICs on interposers that are physically and electrically connected to the antennas using a pressure sensitive adhesive.

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“Improved Method for C-4 Chip Joint”, IBM Technical Disclosure Bulletin, IBM Corp., New York, US vol. 31, No. 6, Nov. 1, 1988 pp. 335-336, XP000054208, ISSN: 0018-8689.

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