Circuit carrier and manufacturing process thereof

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S106000, C438S761000

Reexamination Certificate

active

07338892

ABSTRACT:
A circuit carrier including a core layer, a passive component, a plurality of dielectric layers, and a plurality of circuit layers is provided. The core layer has a first surface and a second surface. In addition, the core layer has a hole, and the passive component is embedded in the hole of the core layer. Furthermore, the circuit layers and the dielectric layers are alternately disposed on the first surface and the second surface of the core layer respectively. The dielectric layers have a plurality of conductive vias, and at least one of the circuit layers is electrically connected to the passive component through the conductive vias. As described above, the electrical performance of the circuit carrier is enhanced. Furthermore, a manufacturing process of the circuit carrier mentioned above is also provided.

REFERENCES:
patent: 6185122 (2001-02-01), Johnson et al.
patent: 6248959 (2001-06-01), Sylvester
patent: 2005/0255303 (2005-11-01), Sawatari et al.
patent: 2006/0118931 (2006-06-01), Ho et al.
patent: 2006/0128069 (2006-06-01), Hsu

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