Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1989-11-13
1991-10-08
Nimmo, Morris H.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174261, 174262, 361401, H05K 100
Patent
active
050556371
ABSTRACT:
Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves may be selectively furnished with solder while other regions may be empty or void of solder. In assembling electronic components, with or without extended leads, such as surface mount integrated circuits or chips, to the solder core circuit boards, the leads may be placed within the regions of the grooves without solder (contact regions) and then the circuit board may be heated selectively or as a whole to reflow the solder to the bonding or contacting regions to bond the traces to the leads upon cooling. Circuit boards having surface mount devices on both sides may be formed in this manner. Further, tape automated bonded or TAB mounted devices may be directly placed into and bonded to the traces or solder core circuit boards with minimum exposure of the excised TAB leads prior to assembly. In one form, the grooves are plated with copper before they are filled with solder. Alternatively, the solder may be present only in cavities or pockets next to the contact regions where the component lead will connect with the conductive material pattern.
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Keys Jerry M.
Mossman David L.
Nimmo Morris H.
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