Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1999-03-18
2000-09-12
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281791, 22826261, B23K 100
Patent
active
06116495&
ABSTRACT:
A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8) The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).
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Berchtold Dieter
Diehm Peter
Lancki Marian
Richter Dietrich
Straub Peter
Heinrich Samuel M.
Siemens AG
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