Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1996-12-30
1999-04-13
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 9, 228 447, 228 565, H01L 21603
Patent
active
058935088
ABSTRACT:
A circuit board for detecting disconnection of a bonding wire, includes a circuit board body; a pattern layer having a die pad region formed on an upper surface of the circuit board body for mounting a semiconductor chip thereon, and respective conductive wire patterns formed on the upper surface and an opposite lower surface of the circuit board body for electrically connecting the semiconductor chip; and via holes perforating through the circuit board body for connecting the conductive wire patterns. The pattern layer further includes bonding leads formed at one end of the conductive wire patterns and connected to the semiconductor chip by bonding wires for electrical connection between the semiconductor chip and the circuit board, and earth terminals formed outside of the die pad region and connected to a device for clamping the circuit board during electrical connection between the semiconductor chip and the circuit board by wire bonding. A detecting device detects a bonding wire disconnection by measuring an electrical resistance at the same time that the wire is bonded on a bonding pad of the semiconductor chip.
REFERENCES:
patent: 3734382 (1973-05-01), Spanjer
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4684884 (1987-08-01), Soderlund
Heinrich Samuel M.
Samsung Electronics Co,. Ltd.
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