Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2000-12-22
2003-09-30
Siek, Vuthe (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000
Reexamination Certificate
active
06629302
ABSTRACT:
This application is based on an application No. H11-364631 filed in Japan, the content of which y incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a design aiding apparatus and a method for aiding the layout design of components in a multilayer circuit board that is formed by laminating a plurality of wiring layers, and a storage medium storing a design aiding program.
2. Prior Art
Conventionally, for packaging of a circuit board composed of a plurality of wiring layers (hereafter referred to as a multilayer wiring board), a packaging technique to mount components on exposed wiring layers of the board (that is, the front surface and the back surface of the board) has been typically used.
A conventional design aiding apparatus for aiding such packaging design has the functions of aiding (1) placement of components on the front and back surfaces of the multilayer wiring board, (2) application of conductive foil on wiring layers, and (3) arrangement of conductors (hereafter referred to as vias) to connect conductive foil laid on adjacent wiring layers.
In recent years, the size of components have been decreased and the packaging techniques have been improved. This has developed a packaging technique to place components between wiring layers and connect the placed components to the wiring layers inside the multilayer wiring board. According to this packaging technique, the packaging density of the multilayer wiring board can be improved as compared with the conventional technique of placing components on the front and back surfaces of the multilayer wiring board. This has the effect of further downsizing multilayer wiring boards. With the use of this packaging technique, the size of equipment is expected to decrease further.
However, the problem is that the above conventional design aiding apparatus does not have the function of aiding the layout design of components in the multilayer wiring board, and so cannot be applied to the packaging technique to place components into the multilayer wiring board. This has been an obstacle to efficient packaging design of a multilayer wiring board in which components are placed.
SUMMARY OF THE INVENTION
The present invention aims to provide a design aiding apparatus, a design aiding method, and a storage medium storing a design aiding program that enable the layout design of components in a multilayer wiring board to be carried out more efficiently.
The above object of the present invention can be achieved by a design aiding apparatus that aids layout design of components in a multilayer wiring board, including: a first acquiring unit operable to acquire first location information that shows a first location in a lamination direction of the multilayer wiring board; a second acquiring unit operable to acquire second information that shows a second location on a two-dimensional plane that is orthogonal to the lamination direction; and a placement unit operable to generate component placement information that shows a space to be occupied by the component, when the component is placed at a location determined by the acquired first location information and the acquired second location information.
According to the above construction, the first acquiring unit acquires location information that shows a placement location of the component in the lamination direction of wiring layers of the multilayer wiring board, and the second acquiring unit acquires location information that shows a placement location of the component on the two-dimensional plane that is orthogonal to the lamination direction, and the placement unit generates placement information that shows a space to be occupied by the component when the component is placed at a location determined by the two types of location information. Accordingly, the design aiding apparatus of the present invention is capable of aiding the layout design of components in the multilayer wiring board.
With the use of the design aiding apparatus of the present invention, the packaging design of the multilayer wiring board in which components are placed can be carried out more efficiently.
(2) The above object of the present invention can also be achieved by a design aiding apparatus that aids layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers, the design aiding apparatus including: a first acquiring unit operable to acquire first location information that shows a first location in a lamination direction of the plurality of wiring layers; a second acquiring unit operable to acquire second location information that shows a second location on a two-dimensional plane that is orthogonal to the lamination direction; and a placement unit operable to generate component placement information that shows a space to be occupied by the component, when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location.
According to the above construction, the first acquiring unit acquires location information that shows a placement location of the component in the lamination direction of wiring layers of the multilayer wiring board, and the second acquiring unit acquires location information that shows a placement location of the component on the two-dimensional plane that is orthogonal to the lamination direction, and the placement unit generates placement information that shows a space to be occupied by the component when the component is placed at a location determined by the two types of location information. Accordingly, the design aiding apparatus of the present invention is capable of aiding the layout design of components in the multilayer wiring board.
With the use of the design aiding apparatus of the present invention, the packaging design of the multilayer wiring board in which components are placed can be carried out more efficiently.
(3) Also, in the design aiding apparatus, the first acquiring unit may include: a wiring layer information acquiring unit operable to acquire layer information that identifies one wiring layer out of the plurality of wiring layers; and a wiring layer location acquiring unit operable to acquire the first location information that shows a location of the identified wiring layer in the lamination direction; and the placement unit of the design aiding apparatus may generate the component placement information, in such a manner that the placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location, the first location being the location of the identified wiring layer in the lamination direction.
According to the above construction, the first acquiring unit acquires location information that shows a placement location of the component in the lamination direction of wiring layers of the multilayer wiring board, and the second acquiring unit acquires location information that shows a placement location of the component on the two-dimensional plane that is orthogonal to the lamination direction, and the placement unit generates placement information that shows a space to be occupied by the component when the component is placed at a location determined by the two types of location information. Accordingly, the design aiding apparatus of the present invention is capable of aiding the layout design of components in the multilayer wiring board.
With the use of the design aiding apparatus of the present invention, the packaging design of the multilayer wiring board in which components are placed can be carried out more efficiently.
(4) Also, in the design aiding apparatus, the first acquiring unit may include: a wiring layer information acquiring unit operable to acquire layer information that identifies one wiring layer out of the plurality of wiring layers; a wiring layer location acquiring unit operable to acquire the first location information that shows a location of
Fukumoto Yukihiro
Ikeda Hiroshi
Miura Shinji
Nakayama Takeshi
Saito Yoshiyuki
Siek Vuthe
Tat Binh C
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