Metal fusion bonding – Process – Plural joints
Patent
1994-01-18
1995-03-28
Ledynh, Bot
Metal fusion bonding
Process
Plural joints
174 35R, 361818, 2281801, 2282341, B23K 3102, H05K 900
Patent
active
054009499
ABSTRACT:
A circuit board assembly including a shielding housing mounted on a circuit board (1), the shielding housing being intended for radio-frequency shieldings. The shielding housing (2) having a wall inclined at an angle .alpha. to a plane orthogonal to the plane of the circuit board. The housing of the circuit board assembly being suitable for at least a partial embedding into an exterior wall of an electronic apparatus.
REFERENCES:
patent: 4370515 (1983-01-01), Donaldson
patent: 4410874 (1983-10-01), Scapple et al.
patent: 4517738 (1985-05-01), Fukuoko et al.
patent: 4626963 (1986-12-01), Speer
patent: 4838475 (1989-06-01), Mullins
patent: 4839774 (1989-06-01), Hamburgen
Hirvonen Timo
Hossi Petri
Leman Ari
Olkkola Jari
Uronen Lasse
Ledynh Bot
Nokia Mobile Phones Ltd.
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