Circuit board assemblies having filled vias free from bleed-out

Details Circuit board assemblies having filled vias free from bleed-out Circuit board assemblies having filled vias free from bleed-out

1998-03-02

2000-09-05

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 174255, 174257, 174262, 430 14, B32B 300

Patent

active

061140198

ABSTRACT:
A circuit assembly that includes a circuitized substrate having a dielectric interior layer with a first surface and at least one hole therein. A filler material substantially fills the hole within the dielectric interior layer. A first wiring layer is positioned on the first surface of the dielectric interior layer, wherein the first wiring layer substantially covers the hole and assists in retaining the filler material within the hole in the dielectric interior layer. A first dielectric photoresist layer is positioned on the first wiring layer and on the first surface of the dielectric interior layer. The first dielectric photoresist layer also includes at least one hole therein. The filler material also substantially fills the hole within the first dielectric photoresist layer. A second wiring layer is positioned on the first dielectric photoresist layer and includes a plurality of conductive pads as part thereof. At least one external component can be electrically coupled to the conductive pads of the second wiring layer.

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