Circuit board and process for producing same

Details Circuit board and process for producing same Circuit board and process for producing same

1993-05-10

1994-11-08

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 156901, 156902, B44C 122, C23F 100

Patent

active

053623592

ABSTRACT:
A circuit board comprising a core material made from magnesium, a magnesium alloy, or a magnesium-based composite material, and an electric circuit formed on the core material. A process for producing the circuit board comprises the steps of (1) forming an electrodeposition-painted coating on such a core material, (2) forming a polyimide resin coating on the electrodeposition-painted coating, (3) forming a via hole extending through the resin coating to the underlying electrodeposition-painted coating, (4) etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the via hole while masking the other region with the resin coating thereby extending the via hole to the core material, (5) forming a metal film on at least a free surface of the resin coating and an inner surface of the extended via hole, and (6) etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern.

REFERENCES:
patent: 3672849 (1972-06-01), Bredzs et al.
patent: 4087300 (1978-05-01), Adler
patent: 4125661 (1978-11-01), Messerschmidt, Jr.
patent: 4609586 (1986-09-01), Jensen et al.
patent: 4746399 (1988-05-01), Demmer et al.
patent: 4913768 (1990-04-01), Wolf et al.
patent: 5207865 (1993-05-01), Satoh

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