Circuit arrangement with semiconductor elements arranged in...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S712000

Reexamination Certificate

active

06940136

ABSTRACT:
A circuit arrangement with semiconductor elements arranged in chips is described. The circuit arrangement is characterized by at least one metal body (s1) for electrically contacting the semiconductor elements and for dissipating the heat produced by the semiconductor elements, said metal body (s1) being adapted to simultaneously function as the support for the semiconductor elements and the chips (c1) of the semiconductor elements being fastened on the body (s1).

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patent: 6849902 (2005-02-01), Lin
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patent: 2 620 862 (1987-09-01), None

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