Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1992-03-31
1994-03-22
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257706, 257717, 257718, 165 802, 174 163, 361704, 361705, 361714, H01L 2302, H01L 2312
Patent
active
052967395
ABSTRACT:
The circuit arrangement comprises a mounting plate carrying at least one preferably chip-form component and contact surfaces electrically conductively connected to the component by connecting elements. The mounting plate is carried on a cooling member and is pressed thereagainst by a pressing arrangement. The pressing arrangement has a mounting element, with an elastically yielding cushion element on the side which is towards the cooling member, to press against the electrical component and/or in the vicinity thereof against the mounting plate in electrically insulated relationship therewith.
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R. C. Chu, `Conduction Path for Elect. Comp.`, IBM Tech Dis. Bull., vol. 19, No. 11, Apr. 1977, p. 4279.
R. C. Chu, `Design for Providing Thermal Interface Material`, IBM Tech Dis. Bull., vol. 20, No. 7, Dec. 1977, pp. 2761-2762.
Gupta and Holt, `Air-Cooled Module with Conformal Inner Fin`, IBM Tech. Dis. Bull., vol. 23, No. 10, Mar. 1981, pp. 4397-4399.
Darrow et al, `Stack Structure for Mixed Tech. Thermal Enhancement`, IBM Tech. Dis. Bull., vol. 22, No. 3, Aug. 1979, pp. 958-959.
Frank Thomas
Goebl Christian
Heilbronner Heinrich
Tursky Werner
Export-Contor Aussenhandelsgesellschaft mbH
Hille Rolf
Kasper Horst M.
Ostrowski David
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