Circuit and method for configuring a redundant bond pad for prob

Details Circuit and method for configuring a redundant bond pad for prob Circuit and method for configuring a redundant bond pad for prob

1998-09-30

2000-08-22

Bowers, Charles

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

257 48, 257203, H01L 2166

Patent

active

061071110

ABSTRACT:
An integrated device includes a redundant bond pad for accessing internal circuitry in the event that the main bond pad for that circuitry is difficult to access with testing equipment. Signals from the redundant bond pad are biased to ground during normal operations of the integrated device. In order to test the relevant internal circuitry, a voltage is applied to a Test Mode Enable bond pad, overcoming the bias that grounds the redundant bond pad. In addition, the signal from the Test Mode Enable bond pad serves to ground any transmission from the main bond pad. As a result, the redundant bond pad may be used to test the relevant internal circuitry given its accessible location in relation to the testing equipment.

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