Drying and gas or vapor contact with solids – Process – Gas or vapor contact with treated material
Patent
1997-06-03
2000-03-21
Bennett, Henry
Drying and gas or vapor contact with solids
Process
Gas or vapor contact with treated material
432239, 34107, F26B 300
Patent
active
060387882
ABSTRACT:
A wafer transfer apparatus used during the processes of manufacturing semiconductor devices has a chuck assembly which includes at least a pair of retainers for accommodating a group of wafers, each wafer retainer having a wafer guide with a plurality of slots formed at regularly spaced intervals and a guide supporter for supporting the wafer guide. At least one nozzle is formed on the wafer guide and is connected to a gas supply member for supplying gas. When the chuck assembly moves downwardly so as to load wafers into a quartz boat, the nozzle sprays the gas so that quartz particles deposited in the slots can be blown off, thereby preventing contamination.
REFERENCES:
patent: 5178639 (1993-01-01), Nishi
patent: 5447294 (1995-09-01), Sakata et al.
patent: 5628121 (1997-05-01), Brooks et al.
patent: 5671119 (1997-09-01), Huang et al.
Bennett Henry
Drake Malik N.
Samsung Electronics Co,. Ltd.
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