Chip with molded cap array

Details Chip with molded cap array Chip with molded cap array

2005-12-27

2005-12-27

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S110000, C438S113000

Reexamination Certificate

active

06979599

ABSTRACT:
A chip is made by a method. The method provides an array of caps for protecting features on a semiconductor wafer. The array is fabricated by a novel method in which a two part mold is used. The array is made from a layer of thermoplastic material which is placed in the mold. Each cap in the array has a central portion and a perimeter wall. The mold is opened so that the array is carried by the first half. The array is applied to a wafer using the first half. After the arrays are applied, the wafer is separated into individual chips.

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patent: 6255741 (2001-07-01), Yoshihara et al.
patent: 6429506 (2002-08-01), Fujii et al.
patent: 6759273 (2004-07-01), Felton et al.

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