Chip separation device and method

Details Chip separation device and method Chip separation device and method

1999-08-05

2000-09-19

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438106, 438462, 438463, H01L 2146, H01L 2178, H01L 21301

Patent

active

061211184

ABSTRACT:
A method for separating semiconductor devices formed on a semiconductor wafer includes: inscribing the semiconductor wafer along scribe lines; mounting the inscribed semiconductor wafer on a stage including an elastic structure and vacuum suction holes that can be aligned to respective semiconductor chips; applying a vacuum through the vacuum suction holes to hold the semiconductor wafer on the elastic structure; and applying a mechanical force to the semiconductor wafer to break the wafer along the scribe lines and separate the semiconductor devices. A device for separating semiconductor devices formed on a wafer includes a stage including an elastic structure and vacuum suction holes that can be aligned with respective semiconductor chips of the semiconductor wafer and a press for applying mechanical force to the semiconductor wafer on the elastic structure. Since use of a wafer tape is avoided in cutting a semiconductor wafer, package cracking and delamination caused by wafer tape adhesive stuck to the back surface of a semiconductor chip are avoided.

REFERENCES:
patent: 5933351 (1999-08-01), Balamurugan
patent: 5953590 (1999-09-01), Piper et al.

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