Chip scale surface mounted device and process of manufacture

Details Chip scale surface mounted device and process of manufacture Chip scale surface mounted device and process of manufacture

2005-05-10

2005-05-10

Everhart, Caridad (Department: 2825)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S772000, C257S782000

Reexamination Certificate

active

06890845

ABSTRACT:
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.

REFERENCES:
patent: 5047833 (1991-09-01), Gould
patent: 5451544 (1995-09-01), Gould
patent: 5703405 (1997-12-01), Zeber
patent: 5726489 (1998-03-01), Matsuda et al.
patent: 5726501 (1998-03-01), Matsubara
patent: 5726502 (1998-03-01), Beddingfield
patent: 5729440 (1998-03-01), Jimarez et al.
patent: 5734201 (1998-03-01), Djennas et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5814884 (1998-09-01), Davis et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5904499 (1999-05-01), Pace
patent: 6013572 (2000-01-01), Hur et al.
patent: 6133634 (2000-10-01), Joshi
patent: 6218281 (2001-04-01), Watanabe et al.
patent: 6268275 (2001-07-01), Cobbley et al.
patent: 6362087 (2002-03-01), Wang et al.
patent: 6391687 (2002-05-01), Cabahug et al.
patent: 6486003 (2002-11-01), Fjelstad
patent: 5-129516 (1993-05-01), None

Affiliated with

Also associated with

Rating

Chip scale surface mounted device and process of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip scale surface mounted device and process of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip scale surface mounted device and process of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3421931