Chip package and producing method thereof

Details Chip package and producing method thereof Chip package and producing method thereof

2008-06-17

2008-06-17

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Schottky barrier

With means to prevent edge breakdown

C257S484000, C257S485000, C257S620000

Reexamination Certificate

active

07388272

ABSTRACT:
A chip package including a carrier, a chip, a stiffener and a molding compound is provided. A producing method of the chip package includes the steps of disposing a bottom surface of the chip on the carrier; covering an edge of a top surface of the chip with the stiffener for protecting the edge; then wire bonding the top surface of the chip with the carrier; and forming the molding compound for encapsulating the chip, the stiffener and parts of the carrier.

REFERENCES:
patent: 5552639 (1996-09-01), Hara et al.
patent: 6167194 (2000-12-01), Moto et al.
patent: 6455910 (2002-09-01), Wang

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