Chip on board assembly

Details Chip on board assembly Chip on board assembly

1992-09-29

1993-09-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 257690, 361764, 361729, 361748, H05K 702

Patent

active

052434974

ABSTRACT:
A chip-on-board assembly and a method of making is described in which semiconductor chips having center contacts are mounted active side down on the circuit board, with the center contacts centered in an elongated opening in the circuit board. The center contacts are connected through the openings in the circuit board to contacts on the circuit board on the opposite side of the circuit board on which the semiconductor chip is mounted. Semiconductor chips are alternately mounted on opposite sides of the circuit board to provide a higher placement density of semiconductor chips.

REFERENCES:
patent: 4891789 (1990-01-01), Quattrini et al.
patent: 4942453 (1990-07-01), Ishida et al.
patent: 5185502 (1993-02-01), Shepherd et al.

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