Chip mounting apparatus

Details Chip mounting apparatus Chip mounting apparatus

1988-08-29

1989-08-22

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156344, 156584, B32B 3118

Patent

active

048592692

ABSTRACT:
In a chip mounting apparatus, a plurality of chips bonded on an adhesive expand tape are mounted one by one onto a package or a printed board. The apparatus is provided with a vacuum pickup member movable in any desired direction for picking up each chip by drawing the vacuum through a suction port formed in it, a plurality of push members movable up and down for pushing up the chip from a lower surface of the tape towards the vacuum pickup member, a tape driving portion for drawing the tape downwards from a peripheral portion of the chip, and an optical sensor for detecting whether or not the tape has been separated from the peripheral portion of the chip in a state in which the chip is being pushed upwards by the push members. The push members are so controlled as to move downwards by virtue of a signal outputted from the optical sensor. The optical sensor may be replaced by a load detecting monitor for detecting a load exerting upon the push rods or tension of the tape.

REFERENCES:
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4466852 (1984-08-01), Beltz et al.
patent: 4472218 (1984-09-01), Avedissian et al.
patent: 4502910 (1985-03-01), Voltmer et al.
patent: 4770737 (1988-09-01), Seki

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