Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-10-26
2009-02-03
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C257SE21511
Reexamination Certificate
active
07485500
ABSTRACT:
A chip module comprises a chip with a chip contact, an insulating structure, which covers the chip and the chip contact at least partly, and a spare contact at an external surface of the insulating structure and a conductive trace for electrically connecting the chip contact to the spare contract.
REFERENCES:
patent: 5236873 (1993-08-01), Anceau et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 2001/0036718 (2001-11-01), Williams
patent: 2002/0117701 (2002-08-01), Sun et al.
patent: 2004/0046250 (2004-03-01), Chua et al.
Ansorge Frank
Kallmayer Christine
Rebholz Christian
Wegerer Gabriele
Coleman W. David
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung
Glenn Michael A.
Glenn Patent Group
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