4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Christine Kallmayer

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Chip module and method for producing a chip module

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Method of joining electronic components to a substrate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-1860127

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