Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-03-30
2008-08-05
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23177, C257SE23065, C361S749000, C361S755000, C174S254000
Reexamination Certificate
active
07408253
ABSTRACT:
The present invention includes a chip-embedded support-frame wrapped-by-flex-circuit package assembly. The package assembly includes a flex circuit having a plurality of patterned connecting-traces. The package assembly further includes a plurality of semiconductor chips mounted on the flex circuits wherein the semiconductor chips having a plurality of contact terminals connected to corresponding connecting traces on the flex circuit. The package assembly further includes a support frame-board having an edge surface placed along predefined folded lines on the flex circuit. The frame-board has a plurality of open spaces for disposing each of the semiconductor chips therein. The flex circuit is provided for folding onto the support frame along the predefined folded lines to form the chip-embedded support-frame wrapped-by-flex-circuit package.
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Diaz José R
Jackson Jerome
Lin Bo-In
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