Chip embedded substrate and method of producing the same

Details Chip embedded substrate and method of producing the same Chip embedded substrate and method of producing the same

2011-08-02

2011-08-02

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S263000, C257S690000, C257S780000

Reexamination Certificate

active

07989707

ABSTRACT:
A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

REFERENCES:
patent: 6188127 (2001-02-01), Senba et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6987314 (2006-01-01), Yoshida et al.
patent: 7049528 (2006-05-01), Kariya et al.
patent: 7141873 (2006-11-01), Aoyagi
patent: 2001/0026864 (2001-10-01), Mori et al.
patent: 2002/0017721 (2002-02-01), Huang
patent: 2002/0152610 (2002-10-01), Nishiyama et al.
patent: 2003/0122240 (2003-07-01), Lin et al.
patent: 2004/0160752 (2004-08-01), Yamashita et al.
patent: 2004/0178508 (2004-09-01), Nishimura et al.
patent: 2004/0196682 (2004-10-01), Funaba et al.
patent: 2004/0238857 (2004-12-01), Beroz et al.
patent: 2005/0006745 (2005-01-01), Nishimura
patent: 2006/0071330 (2006-04-01), Suminoe et al.
patent: 2006/0125077 (2006-06-01), Akaike et al.
patent: 10-178271 (1998-06-01), None
patent: 11-145183 (1999-05-01), None
patent: 11-345815 (1999-12-01), None
patent: 2001007472 (2001-01-01), None
patent: 2001-223231 (2001-08-01), None
patent: 2001267490 (2001-09-01), None
patent: 2003209366 (2003-07-01), None
patent: 2003-303913 (2003-10-01), None
patent: 2003347722 (2003-12-01), None
patent: 2004071858 (2004-03-01), None
patent: 2004-128356 (2004-04-01), None
patent: 2004-153023 (2004-05-01), None
patent: 2004274035 (2004-09-01), None
patent: 2005116932 (2005-04-01), None
patent: 2005150443 (2005-06-01), None
patent: 2005340469 (2005-12-01), None
patent: 97/01866 (1997-01-01), None
patent: 2007/069606 (2007-06-01), None
European Search Report: Appln. No. EP 06 83 4519.
European Search Report: dated Mar. 5, 2011; Appln. EP 10 19 3431.

Affiliated with

Also associated with

Rating

Chip embedded substrate and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip embedded substrate and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip embedded substrate and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2723987