Chip coil manufacturing method

Details Chip coil manufacturing method Chip coil manufacturing method

1991-03-19

1991-12-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156655, 156656, 1566591, 156668, 156901, B44C 122, B29C 3700, C23F 102

Patent

active

050715097

ABSTRACT:
A chip coil includes an insulating substrate on which a spiral coil conductor and first and second terminal electrodes are formed. The coil conductor and the terminal electrodes are made by forming a conductive film on the whole of both main surfaces of the insulating substrate and then etching the same. A first insulation film made of polyimide or polyamide is formed on the insulating substrate so as to cover the coil conductor and the terminal electrodes. The first insulation film is etched such that portions corresponding to the terminal electrodes are removed and a throughhole is formed at a portion corresponding in position to the innermost end of the coil conductor. A further conductive film is formed on the first insulation film and etched so as to form a connecting conductor, the ends of which are respectively connected to the innermost end of the coil conductor and the second terminal electrode, through the throughhole. In addition, a second insulation film is formed on the insulating substrate and subsequently etched, whereby the first and second terminal electrodes are exposed.

REFERENCES:
patent: 2699425 (1955-01-01), Nieter
patent: 3413716 (1968-12-01), Schwertz et al.
patent: 3584376 (1971-06-01), Howe et al.
patent: 3913219 (1975-10-01), Lichtblau
patent: 4075591 (1978-02-01), Haas
patent: 4369557 (1983-01-01), Vandebult
patent: 4682402 (1987-07-01), Yamaguchi
patent: 4873757 (1989-10-01), Williams

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