Chip bonding tool and related apparatus and method

Details Chip bonding tool and related apparatus and method Chip bonding tool and related apparatus and method

2011-02-15

2011-02-15

Crispino, Richard (Department: 1747)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

C156S379600, C156S580000

Reexamination Certificate

active

07886796

ABSTRACT:
A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which spaces the pressing block from the semiconductor chip.

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patent: 2002/0066767 (2002-06-01), Takahashi et al.
patent: 2006/0191631 (2006-08-01), Kojima et al.
patent: 2000-134053 (2000-05-01), None
patent: 10-2005-0123395 (2005-12-01), None

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