Chip assembly in a premold housing

Details Chip assembly in a premold housing Chip assembly in a premold housing

2006-06-20

2006-06-20

Smith, Matthew S. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C250S338100

Reexamination Certificate

active

07064403

ABSTRACT:
A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.

REFERENCES:
patent: 4567006 (1986-01-01), Covington et al.
patent: 4772790 (1988-09-01), Aldridge
patent: 5721430 (1998-02-01), Wong
patent: 5962854 (1999-10-01), Endo
patent: 2003/0118076 (2003-06-01), Schieferdecker et al.
patent: 2005/0030628 (2005-02-01), Wagner et al.

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