Chemically assisted mechanical cleaning of MRAM structures

Details Chemically assisted mechanical cleaning of MRAM structures Chemically assisted mechanical cleaning of MRAM structures

2006-06-27

2006-06-27

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

C134S026000, C134S027000, C134S029000, C134S032000, C134S033000, C134S036000, C134S042000, C438S003000, C438S745000, C438S754000, C438S906000

Reexamination Certificate

active

07067016

ABSTRACT:
A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry.

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