Chemically amplified, radiation-sensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G03F 7004

Patent

active

057311250

ABSTRACT:
A chemically amplified, radiation-sensitive resin composition which comprises a radiation-sensitive acid-generator which generates an acid upon irradiation with a radiation and in which the chemical change due to the catalytic action of said acid changes the solubility of the irradiated portion in a developer to form a pattern, characterized by comprising an anthracene derivative of the formula (1), representatives of which are anthracene-9-methanol and anthracene-9-carboxyethyl.

REFERENCES:
patent: 5164278 (1992-11-01), Brunsvold et al.
patent: 5272042 (1993-12-01), Allen et al.
patent: 5286612 (1994-02-01), Telfer
patent: 5310619 (1994-05-01), Crivello et al.
patent: 5322765 (1994-06-01), Clecak et al.
patent: 5334489 (1994-08-01), Grasshoff et al.
patent: 5338818 (1994-08-01), Brunevold et al.
patent: 5374500 (1994-12-01), Carpenter, Jr. et al.
patent: 5401607 (1995-03-01), Takiff et al.
patent: 5558971 (1996-09-01), Urano et al.
Chemical Abstracts, vol. 122, No. 10, Mar. 6, 1995, AN-118690r.
Chemical Abstracts, vol. 118, No. 8, Feb. 22, 1993, AN-69897v.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chemically amplified, radiation-sensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemically amplified, radiation-sensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemically amplified, radiation-sensitive resin composition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2287718

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.