Chemically amplified positive resist compositions

Details Chemically amplified positive resist compositions Chemically amplified positive resist compositions

1997-06-27

1999-10-26

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430905, G03F 7004

Patent

active

059725591

ABSTRACT:
A chemically amplified positive resist composition is prepared by blending (A) an organic solvent, (B) a base resin in the form of a polyhydroxystyrene having some hydroxyl groups replaced by acid labile groups and a Mw of 3,000-300,000, (C) a photoacid generator, and (D) an aromatic compound having a group: --R.sup.13 --COOH in a molecule. The resist composition is sensitive to actinic radiation, especially KrF excimer laser and X-ray, has high sensitivity, resolution, and plasma etching resistance, and is effective for improving the footing and PED on nitride substrates.

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patent: 5310619 (1994-05-01), Crivello et al.
patent: 5352564 (1994-10-01), Takeda et al.
patent: 5627006 (1997-05-01), Urano et al.
patent: 5683856 (1997-11-01), Aoai et al.
patent: 5736296 (1998-04-01), Sato et al.
patent: 5750309 (1998-05-01), Hatakeyama et al.
patent: 5824824 (1998-10-01), Osawa et al.

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