Chemically amplified positive resist composition

Details Chemically amplified positive resist composition Chemically amplified positive resist composition

1998-07-13

2000-08-22

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430170, 430905, G03F 7004

Patent

active

061069930

ABSTRACT:
A chemically amplified positive resist composition contains (A) an organic solvent, (B) a base resin, (C) a photoacid generator, and optionally, (D) a dissolution rate regulator. The base resin (B) is a hydroxystyrene copolymer having different acid labile groups and Mw of 3,000-300,000. The resist composition is highly sensitive to actinic radiation such as deep-UV, electron beam and X-ray, can be developed with aqueous base to form a pattern, and is thus suitable for use in a fine patterning technique.

REFERENCES:
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patent: 5352564 (1994-10-01), Takeda et al.
patent: 5558976 (1996-09-01), Urano et al.
patent: 5658706 (1997-08-01), Niki et al.
patent: 5876900 (1999-03-01), Watanabe et al.

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