Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-08-16
2011-08-16
Chu, John S (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S907000, C430S910000
Reexamination Certificate
active
07998656
ABSTRACT:
The present invention provides a chemically amplified positive composition comprising: a resin comprising a structural unit represented by the formula (I):wherein R1represents a hydrogen atom, a halogen atom, a C1-C4 alkyl group or a C1-C4 perfluoroalkyl group, Z represents a single bond or —(CH2)k—CO—X4—, k represents an integer of 1 to 4, X1, X2, X3and X4each independently represents an oxygen atom or a sulfur atom, m represents an integer of 1 to 3 and n represents an integer of 0 to 3, and an acid generator.
REFERENCES:
patent: 4075263 (1978-02-01), Lane et al.
patent: 4536554 (1985-08-01), Lim et al.
patent: 6692888 (2004-02-01), Barclay et al.
patent: 2010/0331508 (2010-12-01), Sato et al.
patent: 2011/0009643 (2011-01-01), Nakayama et al.
patent: 2011/0060112 (2011-03-01), Nakayama et al.
patent: 61040279 (1986-02-01), None
patent: 02059570 (1990-02-01), None
patent: WO2009144801 (2009-12-01), None
Hashimoto Kazuhiko
Hiraoka Takashi
Kim Soon Shin
Shimada Masahiko
Takata Yoshiyuki
Birch & Stewart Kolasch & Birch, LLP
Chu John S
Sumitomo Chemical Company Limited
LandOfFree
Chemically amplified positive resist composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemically amplified positive resist composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemically amplified positive resist composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2738783