Chemically amplified positive photosensitive resin composition

Details Chemically amplified positive photosensitive resin composition Chemically amplified positive photosensitive resin composition

2007-08-14

2007-08-14

Hamilton, Cynthia (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S910000, C430S905000, C430S192000, C430S176000, C430S315000, C430S314000, C430S313000, C430S324000

Reexamination Certificate

active

10532364

ABSTRACT:
A photosensitive resin composition suitable for forming a thick film and an ultra-thick film used for forming a thick resist pattern used in the process of forming a magnetic pole on a magnetic head and a bump, which comprises (A) an alkali soluble novolak resin, (B) an alkali soluble acrylic resin, (C) an acetal compound, and (D) an acid generator. A polycondensate comprising a structural unit represented by the following general formula (I) (wherein R represents a saturated alkyl group having 1 to 20 carbon atoms, n is an integer of 1 to 10) as an acetal compound

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English Machine translation of JAPAN 11-095435.
English Language abstract of JP 4-182650.
English Language abstract of 11-095435.
English Language abstract of JP 62-124556.
English Language abstract of JP 62-215947.
English Language abstract of JP 2001-281863.
English Language abstract of JP 2001-312060.
English Language Abstract of JP 11-95435 A.
English Language Abstract of JP 52-80022.
English Language Abstract of JP 54-23570 B2.
English Language Abstract of JP 61-205933 A.
English Language Abstract of JP 2002-229190 A.
English Language Abstract of JP 2002-6503 A.
English Language Abstract of JP 2003-207017 A.
English Language abstract of JP 4-182650, unknown date.
English Language abstract of 11-095435, unknown date.
English Language abstract of JP 62-124556, no date given.
English Language abstract of JP 62-215947, no date given.
English Language Abstract of JP 2001-281863, no date given.
English Language Abstract of JP 2001-312060, no date given.
English Language Abstract of JP 11-95435 A, no date given.
English Language Abstract of JP 52-80022, Aug. 25, 2006.
English Language Abstract of JP 54-23570 B2, Jul. 11, 2006.
English Language Abstract of JP 61-205933 A, Jul. 11, 2006.
English Language Abstract of JP 2002-229190 A, date printed Jul. 11, 2006.
English Language Abstract of JP 2002-6503 A, date printed Jul. 12, 2006.
English Language Abstract of JP 2003-207017 A, date printed Jul. 11, 2006.

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