Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-07-25
2006-07-25
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S910000, C430S271100, C430S326000, C430S311000, C430S313000, C430S314000, C430S315000
Reexamination Certificate
active
07081327
ABSTRACT:
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin formed from a copolymer containing a structural unit (b1) with a specific structure.
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patent: 2004-309777 (2004-11-01), None
DERWENT English abstract for JP 2001194788 (Sato et al).
Machine Assisted English translation of JP 2001194788 (Sato et al), provided by JPO.
U.S. Appl. No. 11/025,591, filed Dec. 29, 2004, Tokyo Ohka Kogyo Co., Ltd.
U.S. Appl. No. 11/025,589, filed Dec. 29, 2004, Tokyo Ohka Kogyo Co., Ltd.
U.S. Appl. No. 11/025,833, filed Dec. 29, 2004, Tokyo Ohka Kogyo Co., Ltd.
Misumi Koichi
Okui Toshiki
Knobbe Martens Olson & Bear LLP
Lee Sin
Tokyo Ohka Kogyo Co. Ltd.
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