Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-04-19
2011-04-19
Kelly, Cynthia H (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S311000, C430S281100, C430S286100
Reexamination Certificate
active
07927778
ABSTRACT:
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) comprises a resin containing a structural unit (b1) with a specific structure, and another resin containing a structural unit (b2) with a specific structure.
REFERENCES:
patent: 5837419 (1998-11-01), Ushirogouchi et al.
patent: 5945250 (1999-08-01), Aoai et al.
patent: 6010826 (2000-01-01), Abe et al.
patent: 6280897 (2001-08-01), Asakawa et al.
patent: 6340553 (2002-01-01), Oomori et al.
patent: 6365321 (2002-04-01), Chen et al.
patent: 6440634 (2002-08-01), Ohsawa et al.
patent: 6689530 (2004-02-01), Ohsawa et al.
patent: 6824956 (2004-11-01), Sato
patent: 6830867 (2004-12-01), Kodama
patent: 7105272 (2006-09-01), Sudo et al.
patent: 2001/0031421 (2001-10-01), Takeda et al.
patent: 2001/0036591 (2001-11-01), Schulz et al.
patent: 2001/0036593 (2001-11-01), Takeda et al.
patent: 2002/0028409 (2002-03-01), Yasunami et al.
patent: 2002/0034704 (2002-03-01), Oomori et al.
patent: 2003/0064319 (2003-04-01), Saito et al.
patent: 2004/0038148 (2004-02-01), Ohta et al.
patent: 2005/0032373 (2005-02-01), Cameron et al.
patent: 2005/0130057 (2005-06-01), Sudo et al.
patent: 2006/0210912 (2006-09-01), Iwanaga et al.
patent: H08-101506 (1996-04-01), None
patent: H08-101508 (1996-04-01), None
patent: H08-137107 (1996-05-01), None
patent: H08-254828 (1996-10-01), None
patent: H09-127691 (1997-05-01), None
patent: H10-307396 (1998-11-01), None
patent: 2000-347405 (2000-12-01), None
patent: 2001-066778 (2001-03-01), None
patent: 2001-122850 (2001-05-01), None
patent: 2001-272785 (2001-10-01), None
patent: 2001-281862 (2001-10-01), None
patent: 2001-281863 (2001-10-01), None
patent: 2001-324814 (2001-11-01), None
patent: 2002-062655 (2002-02-01), None
patent: 2002-258479 (2002-09-01), None
patent: 2004-309775 (2004-11-01), None
patent: 2004-309776 (2004-11-01), None
patent: 2004-309778 (2004-11-01), None
patent: 2004309776 (2004-11-01), None
patent: WO 02-093262 (2002-11-01), None
patent: WO 03069412 (2003-08-01), None
JP2004309776, (machine translation) Nov. 2004.
U.S. Appl. No. 11/025,591, filed Dec. 29, 2004, Tokyo Ohka Kogyo Co., Ltd., (English Abstract Only).
U.S. Appl. No. 11/025,589, filed Dec. 29, 2004, Tokyo Ohka Kogyo Co., Ltd., (English Abstract Only).
U.S. Appl. No. 11/025,870, filed Dec. 29, 2004, Tokyo Ohka Kogyo Co., Ltd., (English Abstract Only).
Office Action issued on Jul. 15, 2008, in the related Japanese Patent Application No. 2003-102955.
Office Action issued on Sep. 30, 2008, in the related Japanese Patent Application No. 2003-102958.
Office Action issued on Sep. 30, 2008, in the related Japanese Patent Application No. 2003-102957.
Misumi Koichi
Okui Toshiki
Johnson Connie P
Kelly Cynthia H
Knobbe Martens Olson & Bear LLP
Tokyo Ohka Kogyo Co. Ltd.
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