Chemical vapor deposition process for depositing tungsten

Details Chemical vapor deposition process for depositing tungsten Chemical vapor deposition process for depositing tungsten

1997-05-16

2000-12-05

Beck, Shrive

Coating processes

Coating by vapor, gas, or smoke

Metal coating

427253, 42725528, 42725539, C23C 1614

Patent

active

06156382&

ABSTRACT:
A multiple step chemical vapor deposition process for depositing a tungsten layer on a substrate. A first step of the deposition process includes a nucleation step in which WF.sub.6 and SiH.sub.4 are introduced into a deposition chamber. Next, the flow of WF.sub.6 and SiH.sub.4 are stopped and diborane is introduced into the chamber for between 5-25 seconds. Finally, during a bulk deposition step, the WF.sub.6 is reintroduced into the chamber along with H.sub.2 and B.sub.2 H.sub.6 flows to deposit a tungsten layer on the substrate. In a preferred embodiment, the bulk deposition step also introduces nitrogen into the process gas.

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