Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1994-02-23
1998-09-01
Krizek, Janice L.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
118725, 20429811, 20419232, C23C 1600
Patent
active
058006869
ABSTRACT:
An improved deposition chamber deposits useful layers on substrates. The improved chamber includes a substrate edge protection system which, in combination with a purge gas, protects selected portions of the edge and underside of the substrate from the deposition gas while preventing the creation of a masked area on the substrate edge. The substrate edge protection system includes a ring, which is received over a substrate received on the substrate support member and which is alignable with the substrate to provide a minimum gap between the edge of the substrate and the ring.
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Lei Lawrence Chung-Lai
Littau Karl
Applied Materials Inc.
Krizek Janice L.
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