Chemical vapor deposition apparatus

Coating apparatus – Gas or vapor deposition

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Details

4271263, 4272481, 4272553, 4272552, 427314, 4274191, 4274192, 4272551, C23C 1600

Patent

active

061102830

ABSTRACT:
A chemical vapor deposition apparatus to reduce generation of contaminants such as residues within the apparatus can be obtained. The chemical vapor deposition apparatus includes a CVD source container, a vaporizer and reaction unit. The vaporizer has a nozzle attached thereto. The nozzle has a tip portion and a thick portion. The reaction unit includes a mixing unit. The mixing unit includes an oxidizer supply pipe as well as a heating portion having a helical side groove and heating means. Reaction unit further includes a reaction chamber surrounded by a wall surface. The inside of the wall surface is covered with an inactive cover layer, and the wall surface is heated to a temperature range of 300-500.degree. C.

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"Surface Morrphologies and Electrical Properties of (BaSr)TiO Films . . . " Kawahara, et al, Jpn. J. Appl. Phys. vol. 34 (1995) pt. 1 No. 9B, Set. 1995 pp. 5077-5082.
"SrTiO Thin Films By MOCVD For 1 Gbit DRAM Application", Lesaicherre et al., Integrated Ferroelectrics, 1995, vol. 8, pp. 201-225.
MOCVD of BASrtiO DOR ULSI DRAMS, Kirlin et al., Integrated Ferroelectrics, 1995, vol. 7, pp. 307-318.

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