Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1995-02-21
1997-09-02
Dang, Thi
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
134 2, 134 3, 252 791, 252 793, 438693, 438906, H01L 2100, C09K 1300
Patent
active
056627696
ABSTRACT:
A process and solution for cleaning Fe contaminants bound to a metallized semiconductor surface after CMP planarization. The solution comprises a PH buffered solution including hydrofluoric acid and a ligand selected from a group consisting of citrates and EDTA.
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Avanzino Steven C.
Schonauer Diana M.
Advanced Micro Devices , Inc.
Dang Thi
Fisher Gerald M.
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