Chemical-sensitization photoresist composition

Details Chemical-sensitization photoresist composition Chemical-sensitization photoresist composition

1998-07-21

1999-08-31

Powers, Fiona T.

Organic compounds -- part of the class 532-570 series

Organic compounds

Diazo or diazonium

534560, 534564, C07D40702, C07C24514

Patent

active

059455179

ABSTRACT:
Proposed is a positive- or negative-working chemical-sensitization photoresist composition having advantages in respect of the contrast and resolution of patterning, photo-sensitivity and cross sectional profile of the patterned resist layer as well as in respect of stability of the latent image formed by pattern-wise exposure to light before post-exposure baking treatment. The composition comprises: (A) 100 parts by weight of a film-forming resinous ingredient which causes a change, i.e. increase or decrease, of solubility in an aqueous alkaline solution by the interaction with an acid; and (B) from 0.5 to 20 parts by weight of a radiation-sensitive acid-generating agent which is a diazomethane compound represented by the general formula

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