Chemical mechanical polishing systems including brushes and rela

Abrading – Abrading process – With tool treating or forming

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Details

451444, B24B 5300

Patent

active

059613777

ABSTRACT:
A chemical-mechanical polishing system includes a polishing pad having a polishing surface for polishing the semiconductor substrate, and a polishing pad brush including a plurality of bristles attached to a support for cleaning the polishing surface of the polishing pad. In addition, a polishing pad brush arm is operatively coupled to the brush support for transferring the polishing pad brush to and from the polishing pad. Related methods are also discussed.

REFERENCES:
patent: 5361545 (1994-11-01), Nakamura
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5536202 (1996-07-01), Appel et al.

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