Chemical/mechanical polishing slurry and chemical mechanical...

Details Chemical/mechanical polishing slurry and chemical mechanical... Chemical/mechanical polishing slurry and chemical mechanical...

2005-03-08

2005-03-08

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Utilizing fluent abradant

C051S298000, C051S309000

Reexamination Certificate

active

06863592

ABSTRACT:
CMP (chemical/mechanical polishing) slurries that can rapidly remove a target layer and can effectively passivate a polishing stopper, with high selectivity. In one aspect, a CMP slurry comprises metal oxide abrasive particles, a removal rate accelerator, an anionic polymeric passivation agent having a molecular weight in a range of about 1,000 to about 100,000, a C1-C12 anionic passivation agent, and water.

REFERENCES:
patent: 5759917 (1998-06-01), Grover et al.
patent: 6383934 (2002-05-01), Sabde et al.
patent: 6540935 (2003-04-01), Lee et al.
patent: 6733553 (2004-05-01), Kido et al.
patent: 20020098696 (2002-07-01), Sabde et al.
patent: 1148 538 (2001-10-01), None
patent: WO 9964527 (1999-12-01), None

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