Abrading – Abrading process
Reexamination Certificate
2007-06-19
2007-06-19
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Abrading process
Reexamination Certificate
active
10964145
ABSTRACT:
A chemical-mechanical polishing (CMP) process for the manufacturing of semiconductor devices is disclosed. The process includes removing a first portion of a first layer of interconnect materials using a first platen and a first slurry, removing a second portion of the first layer using a second platen and a second slurry, removing a first portion of a second layer of the interconnect materials using a second platen and a third slurry, and removing a second portion of the second layer using a third platen and a fourth slurry.
REFERENCES:
patent: 6274475 (2001-08-01), Farkas et al.
patent: 6524959 (2003-02-01), Lu et al.
patent: 6573173 (2003-06-01), Farkas et al.
patent: 6830504 (2004-12-01), Chen et al.
patent: 2004/0074518 (2004-04-01), Korthuis et al.
patent: 2004/0266183 (2004-12-01), Miller et al.
patent: 2005/0016861 (2005-01-01), Laursen et al.
patent: 2005/0090104 (2005-04-01), Yang et al.
Chen Ying-Ho
Chiou Wen-Chih
Yu Chen-Hua
Ackun Jr. Jacob K.
Haynes and Boone LLP
Taiwan Semiconductor Manufacturing Company , Ltd.
LandOfFree
Chemical mechanical polishing process for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical mechanical polishing process for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical polishing process for manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3839803