Chemical mechanical polishing process for manufacturing...

Details Chemical mechanical polishing process for manufacturing... Chemical mechanical polishing process for manufacturing...

2007-06-19

2007-06-19

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

Reexamination Certificate

active

10964145

ABSTRACT:
A chemical-mechanical polishing (CMP) process for the manufacturing of semiconductor devices is disclosed. The process includes removing a first portion of a first layer of interconnect materials using a first platen and a first slurry, removing a second portion of the first layer using a second platen and a second slurry, removing a first portion of a second layer of the interconnect materials using a second platen and a third slurry, and removing a second portion of the second layer using a third platen and a fourth slurry.

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